Invention Grant
- Patent Title: Heat sink assembly for opto-electronic components and a method for producing the same
- Patent Title (中): 光电元件用散热器组件及其制造方法
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Application No.: US14001967Application Date: 2012-03-08
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Publication No.: US09175842B2Publication Date: 2015-11-03
- Inventor: Kimmo Jokelainen , Ville Moilanen , Howard Rupprecht
- Applicant: Kimmo Jokelainen , Ville Moilanen , Howard Rupprecht
- Applicant Address: FI Oulu
- Assignee: Light Therm Oy
- Current Assignee: Light Therm Oy
- Current Assignee Address: FI Oulu
- Priority: GB1103850.2 20110308
- International Application: PCT/FI2012/000014 WO 20120308
- International Announcement: WO2012/120185 WO 20120913
- Main IPC: F21V29/00
- IPC: F21V29/00 ; F21V29/71 ; F21V29/70 ; F21V29/85 ; F21Y101/02
Abstract:
The invention relates to a heat sink assembly and a method for producing the same. The invention can be applied, for example, in solid state lighting in order to improve the efficiency of heat dissipation. The object of the invention is achieved with a solution where effective thermal connection is provided from opto-electrical component in which thermally active inserts are embedded in an injection moulding to plastic heat sink. Solution of the invention can also provide also electrical connections for opto-electrical components.
Public/Granted literature
- US20130335970A1 HEAT SINK ASSEMBLY FOR OPTO-ELECTRONIC COMPONENTS AND A METHOD FOR PRODUCING THE SAME Public/Granted day:2013-12-19
Information query
