Invention Grant
- Patent Title: Micromachined ultra-miniature piezoresistive pressure sensor and method of fabrication of the same
- Patent Title (中): 微加工超微型压阻式压力传感器及其制造方法
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Application No.: US14187221Application Date: 2014-02-22
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Publication No.: US09176018B2Publication Date: 2015-11-03
- Inventor: Bin Qi
- Applicant: Bin Qi
- Agent Ya-Fen Chen
- Main IPC: H01L29/66
- IPC: H01L29/66 ; G01L9/00 ; H01L49/02 ; H01L21/764
Abstract:
A method of fabrication of one or more ultra-miniature piezoresistive pressure sensors on silicon wafers is provided. The diaphragm of the piezoresistive pressure sensors is formed by fusion bonding. The piezoresistive pressure sensors can be formed by silicon deposition, photolithography and etching processes.
Public/Granted literature
- US20140242740A1 MICROMACHINED ULTRA-MINIATURE PIEZORESISTIVE PRESSURE SENSOR AND METHOD OF FABRICATION OF THE SAME Public/Granted day:2014-08-28
Information query
IPC分类:
