An apparatus (10) for handling specimen slides comprises a first module receiving region (18) in which a coverslipping module (100, 200), for coverslipping thin sections arranged on the specimen slides with a coverslipping medium and a coverslipping element, is receivable. A first electrical interface is provided in the first module receiving region (18) for attachment of a coverslipping module (100, 200), this interface being embodied so that by way of it, both a glass coverslipping module (100) for coverslipping with glass wafers and a tape coverslipping module (200) for coverslipping with tapes is attachable. The first module receiving region (18) is furthermore embodied in such a way that a tape coverslipping module (200) or a glass coverslipping module (100) is selectably receivable in it.