Invention Grant
- Patent Title: Test circuit and semiconductor apparatus including the same
- Patent Title (中): 测试电路和包括其的半导体装置
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Application No.: US13604491Application Date: 2012-09-05
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Publication No.: US09176190B2Publication Date: 2015-11-03
- Inventor: Dong Uk Lee , Young Ju Kim
- Applicant: Dong Uk Lee , Young Ju Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2012-0035020 20120404
- Main IPC: G01R19/00
- IPC: G01R19/00 ; G01R31/3185

Abstract:
A test circuit includes a through via test unit configured to be set to a first resistance value in response to a first test control signal and to a second resistance value in response to the first test control signal and a second test control signal, and form a current path including a through via that electrically connects a first chip and a second chip; and a test measurement unit configured to supply a test voltage to the through via and measure a current flowing through the through via.
Public/Granted literature
- US20130265033A1 TEST CIRCUIT AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME Public/Granted day:2013-10-10
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