Invention Grant
- Patent Title: Heat dissipating case
- Patent Title (中): 散热箱
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Application No.: US14235300Application Date: 2011-07-29
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Publication No.: US09176549B2Publication Date: 2015-11-03
- Inventor: Kevin L. Massaro , Mark David Senatori , Ilchan Lee
- Applicant: Kevin L. Massaro , Mark David Senatori , Ilchan Lee
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Legal Department
- International Application: PCT/US2011/046017 WO 20110729
- International Announcement: WO2013/019196 WO 20130207
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20 ; G06F1/16

Abstract:
Example embodiments disclosed herein relate to a case having a base unit and a display unit. The base unit includes an emitting surface. The display unit includes a dissipating member. A hinge connects the base unit and the display unit, the hinge connected below at least part of the heat emitting surface or first vent and the heat dissipating member or second vent. The emitting surface and the dissipating member are to overlap or align when the display unit is in a closed position.
Public/Granted literature
- US20140160659A1 HEAT DISSIPATING CASE Public/Granted day:2014-06-12
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