Invention Grant
- Patent Title: Thermally downward scalable system
- Patent Title (中): 热向下伸缩系统
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Application No.: US12977848Application Date: 2010-12-23
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Publication No.: US09176550B2Publication Date: 2015-11-03
- Inventor: Biswajit Sur , Eric Distefano , James G. Hermerding, II , Eugene P. Matter , John P. Wallace , Guy M. Therien
- Applicant: Biswajit Sur , Eric Distefano , James G. Hermerding, II , Eugene P. Matter , John P. Wallace , Guy M. Therien
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Kacvinsky Daisak Bluni PLLC
- Main IPC: G06F1/32
- IPC: G06F1/32 ; G06F1/20 ; G06F1/26
Abstract:
An apparatus may comprise a power management system. Other embodiments are described and claimed.
Public/Granted literature
- US20120166842A1 THERMALLY DOWNWARD SCALABLE SYSTEM Public/Granted day:2012-06-28
Information query
