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US09177612B2 Smart bridge for memory core 有权
内存核心智能桥

Smart bridge for memory core
Abstract:
An apparatus includes a semiconductor device that includes a multi-ported three-dimensional (3D) memory. The multi-ported 3D memory includes multiple memory cells arranged in multiple physical levels above a substrate. The multi-ported 3D memory includes circuitry associated with operation of the multiple memory cells.
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