Invention Grant
- Patent Title: Polyamide resin composition and molded article comprising the same
- Patent Title (中): 聚酰胺树脂组合物及其制备方法
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Application No.: US13876517Application Date: 2011-09-28
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Publication No.: US09177692B2Publication Date: 2015-11-03
- Inventor: Akio Miyamoto , Masuaki Ichikawa , Tetsuya Yasui
- Applicant: Akio Miyamoto , Masuaki Ichikawa , Tetsuya Yasui
- Applicant Address: JP Yamaguchi
- Assignee: UBE INDUSTRIES, LTD.
- Current Assignee: UBE INDUSTRIES, LTD.
- Current Assignee Address: JP Yamaguchi
- Agency: Buchanan, Ingersoll & Rooney PC
- Priority: JP2010-220330 20100930; JP2010-220337 20100930; JP2010-257790 20101118
- International Application: PCT/JP2011/072205 WO 20110928
- International Announcement: WO2012/043640 WO 20120405
- Main IPC: B32B27/30
- IPC: B32B27/30 ; H01B3/30 ; C08L77/00 ; C08L77/06 ; H01B3/47 ; C08K3/04 ; C08K5/053 ; C08K7/00 ; C08K7/06 ; C08K5/16 ; C08K5/54 ; C08K3/22

Abstract:
A polyamide resin composition comprising defined amounts of flake graphite, carbon fibers, and polyhydric alcohol. A polyamide resin composition comprising a polyamide resin and, as a property imparting component, at least one member selected from the group consisting of a metal oxide, a nitrogen compound, and a silicon compound, wherein a defined amount of the dicarboxylic acid units of the polyamide resin are oxalic acid. A polyamide resin composition comprising a polyamide resin and a defined amount of metal oxide particles, wherein the metal oxide particles contain those having a particle size of 70 μm or more in an amount of 10 to 50% by mass and those having a particle size of 20 μm or less in an amount of 1 to 50% by mass, based on the total mass of the metal oxide particles.
Public/Granted literature
- US20130187080A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING THE SAME Public/Granted day:2013-07-25
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