Invention Grant
- Patent Title: Arrangement for electrically conductively connecting two superconductive conductors
- Patent Title (中): 用于导电连接两根超导导体的布置
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Application No.: US14021464Application Date: 2013-09-09
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Publication No.: US09177698B2Publication Date: 2015-11-03
- Inventor: Rainer Soika , Mark Stemmle
- Applicant: NEXANS
- Applicant Address: FR Paris
- Assignee: NEXANS
- Current Assignee: NEXANS
- Current Assignee Address: FR Paris
- Agency: Sofer & Haroun, LLP
- Priority: EP12306106 20120914
- Main IPC: H01B12/00
- IPC: H01B12/00 ; H01B12/02 ; H01L39/02 ; H01R4/68 ; H02G15/34 ; H01L39/24

Abstract:
An arrangement for electrically conductively connecting two superconductive strip-shaped electrical conductors (1, 2) having at least approximately the same width, where the two conductors (1, 2) rest against each other with their end faces against each other in a connecting point (V). A strip (6) of superconductive material is soldered to the two conductors (1, 2), where the strip extends beyond both conductors so as to cover the connecting point (V). A strip (6) is used which has, only in the area of the connecting point (V) between the two conductors (1, 2), at least approximately the same width as the conductors, and where the strip narrows on both sides of the connecting point (V) and facing away from the connecting point (V).
Public/Granted literature
- US20140080713A1 ARRANGEMENT FOR ELECTRICALLY CONDUCTIVELY CONNECTING TWO SUPERCONDUCTIVE CONDUCTORS Public/Granted day:2014-03-20
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