Invention Grant
- Patent Title: Method for producing a superconducting wire, in particular using lead-free solder
- Patent Title (中): 制造超导线材的方法,特别是使用无铅焊料
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Application No.: US14031058Application Date: 2013-09-19
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Publication No.: US09177699B2Publication Date: 2015-11-03
- Inventor: Burkhard Prause , Manfred Thoener , Andreas Szulczyk
- Applicant: Bruker EAS GmbH
- Applicant Address: DE Hanau
- Assignee: Bruker EAS GmbH
- Current Assignee: Bruker EAS GmbH
- Current Assignee Address: DE Hanau
- Agent Paul Vincent
- Priority: DE102012218250 20121005
- Main IPC: H01B12/02
- IPC: H01B12/02 ; H01L39/14 ; H01L39/24

Abstract:
A method for producing a superconducting wire (10), wherein an internal wire (1), which contains superconducting filaments (4), is provided with a normally conducting stabilizing structure (9), is characterized in that, in a continuous or quasi-continuous process, one or more sheath elements (2; 2a, 2b) are shaped and/or placed around the internal wire (9), so that the entire circumference of the internal wire (1) is enclosed by one or more sheath elements (2; 2a, 2b), and all seams (6; 6a, 6b; 16; 16a, 16b) of sheath element ends (5a-5d; 15a-15d) facing each other are soldered and/or welded. A method for producing a superconducting wire is thereby provided, which restricts the cross section of the superconducting wire to a lesser extent and which permits the use of lead-free solder.
Public/Granted literature
- US20140100117A1 Method for producing a superconducting wire, in particular using lead-free solder Public/Granted day:2014-04-10
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