Invention Grant
- Patent Title: Method of fabricating electronic circuit
- Patent Title (中): 制造电子电路的方法
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Application No.: US14259042Application Date: 2014-04-22
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Publication No.: US09177821B2Publication Date: 2015-11-03
- Inventor: Soon-Won Jung , Jae Bon Koo , Chan Woo Park , Bock Soon Na , Sang Chul Lim , Sang Seok Lee , Kyoung Ik Cho , Hye Yong Chu
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Priority: KR10-2013-0144635 20131126
- Main IPC: H01L21/338
- IPC: H01L21/338 ; H01L21/311 ; H01L29/66
Abstract:
Provided is a method of fabricating an electronic circuit. The method includes preparing a substrate, forming a polymer film on the substrate, patterning the polymer film to form a polymer pattern, and forming an electronic device on the polymer pattern.
Public/Granted literature
- US20150147854A1 METHOD OF FABRICATING ELECTRONIC CIRCUIT Public/Granted day:2015-05-28
Information query
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