Invention Grant
- Patent Title: Pattern forming method
- Patent Title (中): 图案形成方法
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Application No.: US14467213Application Date: 2014-08-25
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Publication No.: US09177825B2Publication Date: 2015-11-03
- Inventor: Yuriko Seino
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2014-052138 20140314
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/027 ; H01L21/02
Abstract:
According to one embodiment, a pattern forming method includes forming, on an underlying region, a neutral film having an affinity for first and second polymers, forming a first pinning part having an affinity for the first polymer by irradiating a first region of the neutral film with an energy beam, forming, on the neutral film including the first pinning part, a block copolymer film containing the first and second polymers, and performing a predetermined treatment for the block copolymer film to perform a microphase separation.
Public/Granted literature
- US20150262837A1 PATTERN FORMING METHOD Public/Granted day:2015-09-17
Information query
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