Invention Grant
- Patent Title: Sensor module
- Patent Title (中): 传感器模块
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Application No.: US13413013Application Date: 2012-03-06
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Publication No.: US09177879B2Publication Date: 2015-11-03
- Inventor: Horst Theuss , Bernd Stadler
- Applicant: Horst Theuss , Bernd Stadler
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01L23/04 ; B81B7/00 ; B81C1/00 ; H01L23/055 ; H04R19/01
Abstract:
A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.
Public/Granted literature
- US20120162948A1 SENSOR MODULE Public/Granted day:2012-06-28
Information query
