Invention Grant
- Patent Title: Semiconductor integrated circuit device, electronic apparatus, and display apparatus
- Patent Title (中): 半导体集成电路器件，电子设备和显示器件
-
Application No.: US14072253Application Date: 2013-11-05
-
Publication No.: US09177882B2Publication Date: 2015-11-03
- Inventor: Hiroyuki Inokuchi , Ken Hashimoto , Tomoya Sakai
- Applicant: ROHM CO., LTD.
- Applicant Address: JP
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP
- Agency: Cantor Colburn LLP
- Priority: JP2012-243296 20121105
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/13 ; H01L23/00 ; H01L25/16 ; H01L23/498 ; H01L23/50 ; H01L29/417 ; H01L29/66 ; H01L27/12 ; H01L21/765
Abstract:
A semiconductor integrated circuit device includes a COF substrate; a semiconductor integrated circuit mounted on the COF substrate and having a first voltage circuit portion operating at a first voltage range and a second voltage circuit portion operating at a second voltage range higher than the first voltage range, the circuit portions being formed on a single chip; and a resin layer for sealing the COF substrate and the semiconductor integrated circuit.
Public/Granted literature
- US20140217426A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, ELECTRONIC APPARATUS, AND DISPLAY APPARATUS Public/Granted day:2014-08-07
Information query
IPC分类:
