Embodiments of the present invention provide a semiconductor structure and method to reduce thermal energy transfer during chip-join processing. In certain embodiments, the semiconductor structure comprises a thermal insulating element formed under a first conductor. The semiconductor structure also comprises a solder bump formed over the first conductor. The semiconductor structure further comprises a second conductor formed on a side of the thermal insulating element and in electrical communication with the first conductor and a third conductor. The third conductor is formed to be in thermal or electrical communication with the thermal insulating element. The thermal insulating element includes thermal insulating material and the thermal insulating element is structured to reduce thermal energy transfer during a chip-join process from the solder bump to a metal level included in the semiconductor structure.