Invention Grant
US09177935B2 Semiconductor device connected by anisotropic conductive film having a reliability adhesive strength
有权
通过具有可靠性粘合强度的各向异性导电膜连接的半导体装置
- Patent Title: Semiconductor device connected by anisotropic conductive film having a reliability adhesive strength
- Patent Title (中): 通过具有可靠性粘合强度的各向异性导电膜连接的半导体装置
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Application No.: US14163113Application Date: 2014-01-24
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Publication No.: US09177935B2Publication Date: 2015-11-03
- Inventor: Youn Jo Ko , Hye Su Ki , Ie Ju Kim
- Applicant: Youn Jo Ko , Hye Su Ki , Ie Ju Kim
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2013-0008546 20130125
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/28 ; H01L23/29 ; H01L23/00 ; C09J9/02
Abstract:
A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a binder resin; a first radical polymerization material having one or two (meth)acrylate reactive groups in a structure thereof and a second radical polymerization material having at least three (meth)acrylate reactive groups in a structure thereof; and conductive particles, the anisotropic conductive film having a moisture permeability of 170 g/m2/24 hr or less and a moisture absorbency of 2% or less.
Public/Granted literature
- US20140210084A1 SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM Public/Granted day:2014-07-31
Information query
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