A semiconductor device includes: a gate electrode and a wiring; a first insulating film covering the gate electrode and the wiring; a semiconductor film opposed to the gate electrode with the first insulating film in between; a first concave section located in a position adjacent to the semiconductor film; a connection hole, the connection hole being provided in the first insulating film, and the connection hole reaching the wiring, and a first electrically-conductive film, the first electrically-conductive film being electrically connected to the wiring through the connection hole, and the first electrically-conductive film being buried in the first concave section.