Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14383942Application Date: 2012-03-22
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Publication No.: US09178014B2Publication Date: 2015-11-03
- Inventor: Masaru Senoo
- Applicant: Masaru Senoo
- Applicant Address: JP Toyota-Shi
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota-Shi
- Agency: Kenyon & Kenyon LLP
- International Application: PCT/JP2012/057328 WO 20120322
- International Announcement: WO2013/140572 WO 20130926
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/40 ; H01L29/739 ; H01L29/78

Abstract:
A semiconductor device includes a semiconductor substrate, and a field plate portion formed on a front surface of a non-cell region. The non-cell region includes a plurality of FLR layers. The FLR layers extend in a first direction along a circumference of the cell region. The field plate portion includes: an insulating film; a plurality of first conducting layers each disposed along a corresponding FLR layer; and a plurality of second conducting layers. The second conducting layers are disposed on part of their corresponding FLR layers in an intermittent manner along the corresponding FLR layers. Each of the second conducting layers includes a front surface portion, a first contact portion, and a second contact portion. Any of the first contact portions and the second contact portions are not provided at positions adjacent to the first contact portion and the second contact portion in the second direction.
Public/Granted literature
- US20150054118A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-02-26
Information query
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