Invention Grant
US09178050B2 Load-short-circuit-tolerant semiconductor device having trench gates
有权
具有沟槽栅极的负载短路容忍半导体器件
- Patent Title: Load-short-circuit-tolerant semiconductor device having trench gates
- Patent Title (中): 具有沟槽栅极的负载短路容忍半导体器件
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Application No.: US14347077Application Date: 2012-09-13
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Publication No.: US09178050B2Publication Date: 2015-11-03
- Inventor: Yasushi Higuchi , Shigemitsu Fukatsu , Masakiyo Sumitomo
- Applicant: Yasushi Higuchi , Shigemitsu Fukatsu , Masakiyo Sumitomo
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2011-211072 20110927; JP2012-196549 20120906
- International Application: PCT/JP2012/005823 WO 20120913
- International Announcement: WO2013/046578 WO 20130404
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/739 ; H01L29/08 ; H01L29/423 ; H01L29/10

Abstract:
In a semiconductor device, a trench gate has a bottom portion in a drift layer and a communication portion extending from a surface of a base layer to communicate with the bottom portion. A distance between adjacent bottom portions is smaller than a distance between adjacent communication portions in a x-direction. A region between adjacent trench gates is divided in a y-direction into an effective region as an electron injection source and an ineffective region which does not serve as the electron injection source. An interval L1 (>0) of the ineffective region in the y-direction, a length D1 of the communication portion in the z-direction, and a length D2 of the bottom portion in the z-direction satisfy L1≦2(D1+D2). The z-direction is orthogonal to a x-y plane defined by the x-direction and the y-direction which are orthogonal to each other.
Public/Granted literature
- US20140217464A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-08-07
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