Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14457484Application Date: 2014-08-12
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Publication No.: US09178063B2Publication Date: 2015-11-03
- Inventor: Wei-Yuan Lu , Li-Ping Huang , Han-Ting Tsai , Wei-Ching Wang , Ming-Shuan Li , Hsueh-Jen Yang , Kuan-Chung Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/78 ; H01L21/265 ; H01L21/324 ; B82Y10/00 ; H01L29/32 ; H01L29/66

Abstract:
A semiconductor device includes a gate structure over a substrate, a source region in the substrate, where the source region is adjacent to the gate structure. Additionally, the semiconductor device includes a drain region in the substrate, where the drain region is adjacent to the gate structure. Moreover, the semiconductor device includes a first dislocation in the substrate between the source region and the drain region. Furthermore, the semiconductor device includes a second dislocation in the substrate between the source region and the drain region, where the second dislocation is substantially parallel to the first dislocation.
Public/Granted literature
- US20140346614A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-11-27
Information query
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