Invention Grant
- Patent Title: Reflective mounting substrates for light emitting diodes
- Patent Title (中): 用于发光二极管的反光安装基板
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Application No.: US11611600Application Date: 2006-12-15
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Publication No.: US09178121B2Publication Date: 2015-11-03
- Inventor: John A. Edmond , Hua-Shuang Kong
- Applicant: John A. Edmond , Hua-Shuang Kong
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/60 ; H01L33/50
Abstract:
A light emitting diode is disclosed that includes a light emitting active structure formed from the Group III nitride material system, a bonding structure supporting the Group III nitride active structure, and a mounting substrate supporting the bonding structure. The mounting substrate includes a material that reflects at least fifty percent of light having the frequencies emitted by the active structure.
Public/Granted literature
- US20080142820A1 Reflective Mounting Substrates For Light Emitting Diodes Public/Granted day:2008-06-19
Information query
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