Invention Grant
US09178122B2 Method of manufacturing light emitting device package having reflector and phosphor layer
有权
制造具有反射器和荧光体层的发光器件封装的方法
- Patent Title: Method of manufacturing light emitting device package having reflector and phosphor layer
- Patent Title (中): 制造具有反射器和荧光体层的发光器件封装的方法
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Application No.: US13672010Application Date: 2012-11-08
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Publication No.: US09178122B2Publication Date: 2015-11-03
- Inventor: Jung Hoon Kim
- Applicant: Jung Hoon Kim
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Suwon-si
- Agency: Ellsworth IP Group PLLC
- Priority: KR10-2011-0116425 20111109
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/60 ; H01L33/62 ; H01L23/00
Abstract:
A method of manufacturing a light emitting device (LED) package includes forming a reflector using nano-imprinting to increase an intensity of light extracted toward an external environment by increasing an angle of a reflector.
Public/Granted literature
- US20130113009A1 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2013-05-09
Information query
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