Invention Grant
- Patent Title: Light emitting device and light emitting device package
- Patent Title (中): 发光器件和发光器件封装
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Application No.: US14149117Application Date: 2014-01-07
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Publication No.: US09178124B2Publication Date: 2015-11-03
- Inventor: Jung Hoon Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0003265 20130111
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/60 ; H01L23/00 ; H01L33/50 ; H01L33/56
Abstract:
According to example embodiments, a light emitting device package includes a package body including nanofibers and light-reflective particles dispersed in a resin, first and second electrodes in the package body, and a light emitting device on the package body. The emitting device is electrically connected to the first and second electrodes.
Public/Granted literature
- US20140197436A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2014-07-17
Information query
IPC分类:
