Invention Grant
- Patent Title: System and process for aluminization of metal-containing substrates
- Patent Title (中): 含金属基底镀铝的系统和工艺
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Application No.: US13966073Application Date: 2013-08-13
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Publication No.: US09178240B2Publication Date: 2015-11-03
- Inventor: Yeong-Shyung Chou , Jeffry W. Stevenson
- Applicant: Yeong-Shyung Chou , Jeffry W. Stevenson
- Applicant Address: US WA Richland
- Assignee: BATTELLE MEMORIAL INSTITUTE
- Current Assignee: BATTELLE MEMORIAL INSTITUTE
- Current Assignee Address: US WA Richland
- Agent James D. Matheson
- Main IPC: C23C8/10
- IPC: C23C8/10 ; H01M8/12 ; C23C8/12 ; C23C26/00 ; H01M8/02
Abstract:
A system and method are detailed for aluminizing surfaces of metallic substrates, parts, and components with a protective alumina layer in-situ. Aluminum (Al) foil sandwiched between the metallic components and a refractory material when heated in an oxidizing gas under a compression load at a selected temperature forms the protective alumina coating on the surface of the metallic components. The alumina coating minimizes evaporation of volatile metals from the metallic substrates, parts, and components in assembled devices during operation at high temperature that can degrade performance.
Public/Granted literature
- US20140048183A1 SYSTEM AND PROCESS FOR ALUMINIZATION OF METAL-CONTAINING SUBSTRATES Public/Granted day:2014-02-20
Information query
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