Invention Grant
- Patent Title: Waterproof connector and wire seal
- Patent Title (中): 防水连接器和电线密封
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Application No.: US13937620Application Date: 2013-07-09
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Publication No.: US09178301B2Publication Date: 2015-11-03
- Inventor: Katsumi Shiga
- Applicant: Tyco Electronics Japan G.K.
- Applicant Address: JP Kanagawa-ken
- Assignee: Tyco Electronics Japan G.K.
- Current Assignee: Tyco Electronics Japan G.K.
- Current Assignee Address: JP Kanagawa-ken
- Agent Barley Snyder
- Priority: JP2012-153780 20120709
- Main IPC: H01R13/40
- IPC: H01R13/40 ; H01R13/52

Abstract:
A wire seal for a waterproof connector having a seal body with a mating end surface and a terminal end surface, a plurality of wire insertion passageways extending through the seal body from the mating end surface to the terminal end surface, inner seal projections disposed on an inner peripheral wall of each of the wire insertion passageways, and relief grooves disposed on the mating end surface and the terminal end surface between adjacent wire insertion passageways.
Public/Granted literature
- US20140011400A1 Waterproof Connector and Wire Seal Public/Granted day:2014-01-09
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