Invention Grant
- Patent Title: Multi-band interconnect for inter-chip and intra-chip communications
- Patent Title (中): 用于芯片间和片内通信的多频互连
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Application No.: US13965077Application Date: 2013-08-12
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Publication No.: US09178725B2Publication Date: 2015-11-03
- Inventor: Mau-Chung Chang , Sai-Wang Tam , Gyung-Su Byun , Yanghyo Kim , Kanit Therdsteerasukdi , Jeremy Ir , Glenn Reinman , Jingsheng Cong
- Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Applicant Address: US CA Oakland
- Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee Address: US CA Oakland
- Agent John P. O'Banion
- Main IPC: H04B1/38
- IPC: H04B1/38 ; H04L5/16 ; H04L25/02 ; G06F15/78 ; H04L12/773 ; G11C5/06 ; G11C7/10 ; H04L27/04
Abstract:
Systems, apparatus, modules, and methods of communicating with memory devices utilizing multi-band communication containing a baseband and one or more amplitude shift keyed (ASK) RF channels over each differential pair of off-chip transmission lines. Configurations are described for interfacing between microprocessors, or controllers and memory devices or modules, and within a DIMM and its DRAM devices, and between multiple DIMM memory modules.
Public/Granted literature
- US20140044157A1 MULTI-BAND INTERCONNECT FOR INTER-CHIP AND INTRA-CHIP COMMUNICATIONS Public/Granted day:2014-02-13
Information query
