Invention Grant
- Patent Title: Methods for forming metallized dielectric structures
- Patent Title (中): 形成金属化电介质结构的方法
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Application No.: US13714186Application Date: 2012-12-13
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Publication No.: US09179537B2Publication Date: 2015-11-03
- Inventor: Benjamin M. Rappoport
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group
- Agent G. Victor Treyz; Joseph F. Guihan
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H05K1/02 ; H01Q1/38 ; H05K3/28

Abstract:
An electronic device may be provided with metal coated dielectric structures that serve as electromagnetic interference shielding, antenna structures, or other metal structures. The metal coated dielectric structures may be formed form a sheet of polymer. Metal may be deposited on the sheet of polymer using a deposition tool and patterned following deposition or may be patterned during deposition. A dielectric sheet having patterned metal may be shaped into a desired shape using molding equipment or other equipment that applies heat and pressure to the dielectric sheet and patterned metal. Metal on a dielectric sheet may also be patterned after the dielectric sheet is formed into a desired shape. Metal may be formed on opposing sides of the dielectric sheet.
Public/Granted literature
- US20140166350A1 Methods for Forming Metallized Dielectric Structures Public/Granted day:2014-06-19
Information query
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