Invention Grant
US09179545B2 Base material with a conductor pattern,and a method of forming a base material with a conductor pattern
有权
具有导体图案的基材，以及形成具有导体图案的基材的方法
- Patent Title: Base material with a conductor pattern,and a method of forming a base material with a conductor pattern
- Patent Title (中): 具有导体图案的基材，以及形成具有导体图案的基材的方法
-
Application No.: US13504862Application Date: 2010-10-27
-
Publication No.: US09179545B2Publication Date: 2015-11-03
- Inventor: Shin Kuwabara
- Applicant: Shin Kuwabara
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2009-247077 20091027; JP2009-247125 20091027
- International Application: PCT/JP2010/069077 WO 20101027
- International Announcement: WO2011/052641 WO 20110505
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/38 ; B41M1/10 ; B41M1/30 ; H05K3/12 ; H05K9/00 ; B32B7/02 ; B32B23/04 ; B32B23/20
Abstract:
Provided is a base material having a conductor pattern formed thereon, which is obtained by forming, at a high productivity on a base material, a conductor pattern having a lower surface resistivity and a higher conductivity than in the related art. A receiving layer 5 made of a cellulose acetate alkylate is formed on a surface of a base material 4. A conductor pattern 6 is formed by printing a conductive paste 3 in a predetermined pattern shape onto the surface of the receiving layer 5.
Public/Granted literature
- US20120241203A1 CONDUCTOR PATTERN FORMING METHOD AND CONDUCTOR PATTERN Public/Granted day:2012-09-27
Information query
