Invention Grant
- Patent Title: Method for assembling a chip in a flexible substrate
- Patent Title (中): 将芯片组装在柔性基板中的方法
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Application No.: US13702173Application Date: 2011-07-05
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Publication No.: US09179586B2Publication Date: 2015-11-03
- Inventor: Jean Brun
- Applicant: Jean Brun
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oliff PLC
- Priority: FR1002846 20100706
- International Application: PCT/FR2011/000395 WO 20110705
- International Announcement: WO2012/007655 WO 20120119
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K13/04 ; H01L23/498 ; H01L23/00 ; H05K1/18 ; H01L23/13 ; H01L23/538 ; H01L25/065 ; H01L25/00 ; H05K1/02 ; H05K1/03
Abstract:
A substrate provided with an electrically conducting wire coated with an electrically insulating material is impregnated with a polymerizable material. A reception area for a chip is formed on a surface of the substrate by means of deformation. The housing area is stiffened using the polymerizable material. The chip is disposed in the reception area and an electrical connection area of the chip is connected electrically to the electrically conducting wire of the substrate.
Public/Granted literature
- US20130074331A1 METHOD FOR ASSEMBLING A CHIP IN A FLEXIBLE SUBSTRATE Public/Granted day:2013-03-28
Information query
