Invention Grant
US09182273B2 Imaging device, inspection apparatus, and method of manufacturing electronic device
有权
成像装置，检查装置以及电子装置的制造方法
- Patent Title: Imaging device, inspection apparatus, and method of manufacturing electronic device
- Patent Title (中): 成像装置，检查装置以及电子装置的制造方法
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Application No.: US13971044Application Date: 2013-08-20
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Publication No.: US09182273B2Publication Date: 2015-11-10
- Inventor: Takefumi Fukagawa , Takashi Miyata , Satoshi Higuchi , Tatsuya Okamoto
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-191445 20120831
- Main IPC: H01L27/00
- IPC: H01L27/00 ; G01J1/42 ; G02B3/00 ; H01L27/146 ; G01J1/04
Abstract:
The imaging device includes a sensor substrate, a light-blocking substrate, a light-collecting substrate, a sealing material, and a light-transmitting member. The light-transmitting member includes a light-transmitting base disposed to be in contact with either the sensor substrate or the light-blocking substrate, and a light-transmitting resin which is filled between the base and the sensor substrate or the light-blocking substrate. A void is formed in at least a part of a space between the sealing material and the light-transmitting member.
Public/Granted literature
- US20140061431A1 IMAGING DEVICE, INSPECTION APPARATUS, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2014-03-06
Information query
IPC分类:
