Invention Grant
- Patent Title: Method for burying conductive mesh in transparent electrode
- Patent Title (中): 在透明电极中埋入导电网的方法
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Application No.: US13533127Application Date: 2012-06-26
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Publication No.: US09182858B2Publication Date: 2015-11-10
- Inventor: Taik Min Lee , In Young Kim , Jeong Dai Jo , Dong-Soo Kim
- Applicant: Taik Min Lee , In Young Kim , Jeong Dai Jo , Dong-Soo Kim
- Applicant Address: KR Daejeon
- Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
- Current Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
- Current Assignee Address: KR Daejeon
- Agency: Lex IP Meister, PLLC
- Priority: KR10-2011-0076817 20110802
- Main IPC: H05K3/10
- IPC: H05K3/10 ; G06F3/044 ; G06F3/045 ; H01L31/0224 ; H01R43/04 ; H05K3/12 ; G02F1/1343
Abstract:
The present invention relates to a method for burying a conductive mesh in a transparent electrode, and more particularly, to a method which prevents a conductive mesh from protruding from a transparent electrode by burying the conductive mesh in the transparent electrode.
Public/Granted literature
- US20130031781A1 METHOD FOR BURYING CONDUCTIVE MESH IN TRANSPARENT ELECTRODE Public/Granted day:2013-02-07
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