Invention Grant
- Patent Title: Chip component, substrate and electronic apparatus
- Patent Title (中): 芯片组件,基板和电子设备
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Application No.: US13489028Application Date: 2012-06-05
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Publication No.: US09183988B2Publication Date: 2015-11-10
- Inventor: Kotaro Fujimori
- Applicant: Kotaro Fujimori
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,Sony Mobile Communications Inc.
- Current Assignee: Sony Corporation,Sony Mobile Communications Inc.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01G4/40 ; H01G4/38 ; H01C1/16 ; H01G4/228 ; H05K1/02 ; H05K1/18 ; H01F17/00

Abstract:
A chip component is provided with a block including a dielectric, input and output terminals, which are the first and second terminals that are provided on the surface of the block, an adjustment terminal that is a third terminal that includes an internal electrode extended into the block and that is provided on the surface of the block, and at least two inter-terminal circuits that are provided in the block and that are connected between at least two sets of two terminals of the first, second, and third terminals.
Public/Granted literature
- US20130003334A1 CHIP COMPONENT, SUBSTRATE AND ELECTRONIC APPARATUS Public/Granted day:2013-01-03
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