Invention Grant
- Patent Title: Electronic component conveying apparatus
- Patent Title (中): 电子部件输送装置
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Application No.: US14192008Application Date: 2014-02-27
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Publication No.: US09184076B2Publication Date: 2015-11-10
- Inventor: Takamitsu Aihara
- Applicant: SYNAX CO., LTD.
- Applicant Address: JP
- Assignee: Synax Co., Ltd.
- Current Assignee: Synax Co., Ltd.
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2013-120835 20130607
- Main IPC: H01L21/673
- IPC: H01L21/673 ; B65G17/02

Abstract:
A first and second guide block pieces retain a plurality of electronic components in an electronic component retention space formed and fixed on a shuttle plate by using a position determination hole formed in advance in accordance with a distance between a pair of opposing corners of a bottom surface of an electronic component, and by emitting light ranging from one end portion to the other end portion of the shuttle plate along an upper surface of a plurality of electronic components interposed and retained between the electronic component interposing-and-retaining portions along longitudinal directions of the first and second guide block pieces, an optical sensor detects that the emitted light is blocked by an irregularly inclined electronic component.
Public/Granted literature
- US20140360846A1 ELECTRONIC COMPONENT CONVEYING APPARATUS Public/Granted day:2014-12-11
Information query
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