Invention Grant
- Patent Title: Lead frame with abutment surface
- Patent Title (中): 引导框架与邻接表面
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Application No.: US14691690Application Date: 2015-04-21
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Publication No.: US09184119B2Publication Date: 2015-11-10
- Inventor: Lee Han Meng@ Eugene Lee , Sueann Lim Wei Fen , Sarel Bin Ismail
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A lead frame device may include an integral die pad member, two separate finger members, a central body portion, each of the finger members have a top and a bottom surface connected by a peripheral edge surface. The lead frame also has a first ear portion, and a second ear portion, each has an ear top surface and an ear bottom surface coplanar with the top surface and bottom surface of the central body portion. The lead frame also has a first longitudinally extending groove and second longitudinally extending groove separate the first ear portion and the second ear portion from the central portion. The first ear portion and the second ear portion each have an abutment surface.
Public/Granted literature
- US20150228563A1 LEAD FRAME WITH ABUTMENT SURFACE Public/Granted day:2015-08-13
Information query
IPC分类:
