A semiconductor package having a metal frame includes a frame-shaped conductive member which has an opening portion, mounted on a substrate, and a semiconductor element disposed within the opening. A ring-shaped wiring pattern is provided on a portion of the substrate outwards from the opening portion of the conductive member. The electrostatic coupling capacity of the ring-shaped wiring pattern and the conductive member is not less than the electrostatic coupling capacity of a semiconductor metal wiring layer and the conductive member. The ring-shaped wiring pattern and the ground wiring of the semiconductor metal wiring layer are electrically connected.