A semiconductor package includes a chip, a sealing body covering the chip, and a plurality of external connection terminals connected to the chip. The external connection terminals expose from a surface of the sealing body and are arranged in a grid on the surface of the sealing body. In the grid on the surface of the sealing body, each external connection terminal is adjacent to an area vacant of an other external connection terminal in at least one direction of eight directions from each external connection terminal, the eight directions including first linear directions along a row of the grid, second linear directions along a row of the grid perpendicular to the first linear directions, and four diagonal directions defined between the first linear directions and the second linear directions.