Invention Grant
- Patent Title: Semiconductor device and method for manufacturing same
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US13790282Application Date: 2013-03-08
-
Publication No.: US09184229B2Publication Date: 2015-11-10
- Inventor: Chiharu Ota , Johji Nishio , Kazuto Takao , Takashi Shinohe
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-170278 20120731
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L29/15 ; H01L29/06 ; H01L21/02 ; H01L29/872 ; H01L29/66 ; H01L29/739 ; H01L29/78 ; H01L29/861 ; H01L29/161 ; H01L29/165 ; H01L29/167 ; H01L29/16

Abstract:
According to one embodiment, a semiconductor device, includes: a first semiconductor region of a first conductivity type; a second semiconductor region provided on the first semiconductor region, an impurity concentration of the second semiconductor region being lower than an impurity concentration of the first semiconductor region; a third semiconductor region of a second conductivity type provided on the second semiconductor region; and a fourth semiconductor region provided on the third semiconductor region or in a portion of the third semiconductor region. A lattice strain of the fourth semiconductor region is greater than a lattice strain of the third semiconductor region.
Public/Granted literature
- US20140034965A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2014-02-06
Information query
IPC分类: