Invention Grant
- Patent Title: Method of producing aluminum structure and aluminum structure
- Patent Title (中): 生产铝结构和铝结构的方法
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Application No.: US13363694Application Date: 2012-02-01
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Publication No.: US09184448B2Publication Date: 2015-11-10
- Inventor: Kotaro Kimura , Akihisa Hosoe , Takayasu Sugihara , Osamu Ohama , Kazuki Okuno , Tomoyuki Awazu , Koji Nitta
- Applicant: Kotaro Kimura , Akihisa Hosoe , Takayasu Sugihara , Osamu Ohama , Kazuki Okuno , Tomoyuki Awazu , Koji Nitta
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2010-206243 20100915
- Main IPC: C25D11/04
- IPC: C25D11/04 ; H01M4/80 ; C25D1/08 ; C25D3/66 ; C25D5/56 ; H01G11/30 ; H01G11/68 ; H01G11/70 ; H01G11/86 ; H01M4/66

Abstract:
Provided is a method of producing an aluminum structure using a porous resin molded body having a three-dimensional network structure, with which it is possible to form an aluminum structure having a low oxide content in the surface of aluminum (i.e., having an oxide film with a small thickness), and in particular, it is possible to obtain an aluminum porous body that has a large area. The method includes a step of preparing an aluminum-coated resin molded body in which an aluminum layer is formed, directly or with another layer therebetween, on a surface of a resin molded body composed of urethane, and a heat treatment step in which the aluminum-coated resin molded body is subjected to heat treatment at a temperature equal to or higher than 270° C. and lower than 660° C. to decompose the resin molded body.
Public/Granted literature
- US20120183804A1 METHOD OF PRODUCING ALUMINUM STRUCTURE AND ALUMINUM STRUCTURE Public/Granted day:2012-07-19
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