Invention Grant
- Patent Title: Spring structure and slide phone using spring structure
- Patent Title (中): 弹簧结构和滑盖手机采用弹簧结构
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Application No.: US14132939Application Date: 2013-12-18
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Publication No.: US09185195B2Publication Date: 2015-11-10
- Inventor: Jiao Yu , Xin Zhu , Bo Huang , Peng Wu , Liang Zou
- Applicant: Huawei Device Co., LTD
- Applicant Address: CN Shenzhen
- Assignee: Huawei Device Co., LTD.
- Current Assignee: Huawei Device Co., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Slater & Matsil, L.L.P.
- Priority: CN201110296461 20110927
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H04M1/02
Abstract:
A spring structure includes a support body, a first support rod, a second support rod, a first spring, a second spring, a first mounting member, and a second mounting member used for connecting to a lower shell of the slide phone. An installation hole running through the support body is disposed on the support body. One end of the first support rod is connected to the first mounting member and the other end is inserted in the installation hole of the support body. The first support rod may move along the installation hole and is sleeved with the first spring. One end of the second support rod is connected to the second mounting member and the other end is inserted in the installation hole of the support body.
Public/Granted literature
- US20140106830A1 Spring Structure and Slide Phone Using Spring Structure Public/Granted day:2014-04-17
Information query
