Invention Grant
- Patent Title: Apparatus and methods for placement of discrete components on internal printed circuit board layers
- Patent Title (中): 将分立元件放置在内部印刷电路板层上的装置和方法
-
Application No.: US13956079Application Date: 2013-07-31
-
Publication No.: US09185794B1Publication Date: 2015-11-10
- Inventor: Boris Reynov , Oscar Diaz-Landa , Shreeram Siddhaye , Chebrolu S. Srinivas , Lee M. Forbes , Mark Simpson , Mark Devenport
- Applicant: Juniper Networks, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Juniper Networks, Inc.
- Current Assignee: Juniper Networks, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Cooley LLP
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02 ; H05K3/30
Abstract:
A printed circuit board (PCB) defines a first outer surface and a second outer surface that is opposite the first outer surface. The first outer surface of the PCB defines a recess. The PCB includes a signal layer between the first outer surface and the second surface with a first portion exposed within the recess and a second portion exposed within the recess. A component is disposed within the recess and connected to the first portion and the second portion of the signal layer such that an entirety of the component is within the recess and below the first surface.
Information query
