Invention Grant
- Patent Title: High-frequency signal transmission line
- Patent Title (中): 高频信号传输线
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Application No.: US14103914Application Date: 2013-12-12
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Publication No.: US09185795B2Publication Date: 2015-11-10
- Inventor: Noboru Kato , Shigeru Tago , Jun Sasaki , Satoshi Sasaki
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-270123 20101203; JP2011-103644 20110506; JP2011-218074 20110930
- Main IPC: H03H7/38
- IPC: H03H7/38 ; H05K1/02 ; H01P3/02 ; H04B15/00 ; H01P3/10 ; H01P3/08 ; H01P3/12 ; H01P3/00 ; H05K1/03 ; H05K1/11 ; H01P1/203

Abstract:
Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ∈1 and has a first principal surface and a second principal surface. A signal line is provided in the dielectric element assembly. A ground conductor is provided in the dielectric element assembly and on the first principal surface side with respect to the signal line, faces the signal line, and is provided with an opening that overlaps the signal line. A high dielectric constant layer has a relative dielectric constant ∈2 higher than the relative dielectric constant ∈1 and is provided on the first principal surface so as to overlap the opening.
Public/Granted literature
- US20140097916A1 HIGH-FREQUENCY SIGNAL TRANSMISSION LINE Public/Granted day:2014-04-10
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