Invention Grant
US09185798B2 Device components with surface-embedded additives and related manufacturing methods
有权
具有表面嵌入添加剂的器件组件及相关制造方法
- Patent Title: Device components with surface-embedded additives and related manufacturing methods
- Patent Title (中): 具有表面嵌入添加剂的器件组件及相关制造方法
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Application No.: US14299938Application Date: 2014-06-09
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Publication No.: US09185798B2Publication Date: 2015-11-10
- Inventor: Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal
- Applicant: INNOVA DYNAMICS, INC.
- Applicant Address: US CA San Francisco
- Assignee: INNOVA DYNAMICS, INC.
- Current Assignee: INNOVA DYNAMICS, INC.
- Current Assignee Address: US CA San Francisco
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L31/048 ; H01L31/0216 ; H05K1/02 ; H01L31/055 ; H05K1/09 ; H05K1/11

Abstract:
Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Public/Granted literature
- US20150014022A1 Device Components With Surface-Embedded Additives And Related Manufacturing Methods Public/Granted day:2015-01-15
Information query
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