Invention Grant
- Patent Title: Flexible printed circuit board with component mounting section for mounting electronic component and flexible cables extending in different directions from the component mounting section, and method of manufacturing the same
- Patent Title (中): 柔性印刷电路板,其具有用于安装电子部件的部件安装部和从部件安装部沿不同方向延伸的柔性电缆及其制造方法
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Application No.: US13138752Application Date: 2010-12-07
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Publication No.: US09185802B2Publication Date: 2015-11-10
- Inventor: Fumihiko Matsuda
- Applicant: Fumihiko Matsuda
- Applicant Address: JP Tokyo
- Assignee: NIPPON MEKTRON, LTD.
- Current Assignee: NIPPON MEKTRON, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Jacobson Holman, PLLC.
- Priority: JP2010-167411 20100726
- International Application: PCT/JP2010/071898 WO 20101207
- International Announcement: WO2012/014339 WO 20120202
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/14 ; H05K3/00 ; H05K1/11

Abstract:
A method of manufacturing a flexible printed circuit board that includes a component mounting section having lands, a plurality of flexible cable sections having wirings and extending in different directions from the component mounting section, and a connection section having terminals connected with the land through the wiring, the method including manufacturing partial FPCs in a sheet in a unit of a partial FPC that includes a partial component mounting section that is a part of the component mounting section, a cable section extending from the partial component mounting section, and a connection section disposed in the cable section, cutting out the partial FPC from the sheet, performing an alignment using alignment targets of the partial FPC and a support plate so that the partial component mounting sections of respective partial FPCs configure the component mounting section, and fixing the partial FPCs onto the support plate.
Public/Granted literature
- US20120175154A1 FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-07-12
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