Invention Grant
- Patent Title: Sequenced orthogonal disconnection of electronic modules
- Patent Title (中): 电子模块的顺序正交断开
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Application No.: US14146842Application Date: 2014-01-03
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Publication No.: US09185819B2Publication Date: 2015-11-10
- Inventor: Jeremy S. Bridges , Daniel P. Kelaher , William M. Megarity
- Applicant: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Current Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Katherine S. Brown; Andrew M. Calderon
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K5/02

Abstract:
An electronic enclosure includes a first electronic module, a second electronic module, a third electronic module and a handle. The first electronic module is physically connected to the second electronic module and the third electronic module is physically connected to the second electronic module. The second electronic module vertically disengages from the first electronic module and the third electronic module horizontally disengages from the second electronic module. The handle forces sequenced orthogonal disconnection of the electronic modules such that the third electronic module horizontally disengages from the second electronic module prior to the second electronic module vertically disengages from the first electronic module.
Public/Granted literature
- US20150195940A1 SEQUENCED ORTHOGONAL DISCONNECTION OF ELECTRONIC MODULES Public/Granted day:2015-07-09
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