Invention Grant
- Patent Title: Metal coating for indium bump bonding
- Patent Title (中): 用于铟凸块焊接的金属涂层
-
Application No.: US13168505Application Date: 2011-06-24
-
Publication No.: US09190377B2Publication Date: 2015-11-17
- Inventor: Sihai Chen , Ning-Cheng Lee
- Applicant: Sihai Chen , Ning-Cheng Lee
- Applicant Address: US NY Clinton
- Assignee: Indium Corporation
- Current Assignee: Indium Corporation
- Current Assignee Address: US NY Clinton
- Agency: Sheppard Mullin Richter & Hampton LLP
- Main IPC: H01B1/08
- IPC: H01B1/08 ; H01L23/00 ; H01L27/146

Abstract:
A process of making efficient metal bump bonding with relative low temperature, preferably lower than the melting point of Indium, is described. To obtaining a lower processing temperature (preferred embodiments have a melting point of
Public/Granted literature
- US20110315429A1 METAL COATING FOR INDIUM BUMP BONDING Public/Granted day:2011-12-29
Information query