Invention Grant
- Patent Title: Thin plastic leadless package with exposed metal die paddle
- Patent Title (中): 薄塑料无铅封装，外露金属裸片
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Application No.: US11929418Application Date: 2007-10-30
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Publication No.: US09190385B2Publication Date: 2015-11-17
- Inventor: Mow Lum Yee , Kam Chuan Lau , Kok Siang Goh , Shang Yan Choong , Voon Joon Liew , Chee Sang Yip
- Applicant: Mow Lum Yee , Kam Chuan Lau , Kok Siang Goh , Shang Yan Choong , Voon Joon Liew , Chee Sang Yip
- Applicant Address: MY Ipoh Perak
- Assignee: Carsem (M) SDN. BHD.
- Current Assignee: Carsem (M) SDN. BHD.
- Current Assignee Address: MY Ipoh Perak
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: MYPI20071214 20070725
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L21/48 ; H01L21/56 ; H01L21/683 ; H01L23/31 ; H01L23/495
Abstract:
A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps. The electronic package includes a leadframe having a plurality of leads, wherein each of the leads has a lead tip, an opening formed within the leadframe, a die paddle that is disposed within the opening and is isolated from each of the lead tips, a tape that is adhered to a back side of the leadframe, leads, and die paddle, and a die, wherein the die is attached to the die paddle and is connected by wires to a bump disposed on each of the lead tips.
Public/Granted literature
- US20090026594A1 Thin Plastic Leadless Package with Exposed Metal Die Paddle Public/Granted day:2009-01-29
Information query
IPC分类:
