Invention Grant
- Patent Title: Three-dimensional structured memory devices
- Patent Title (中): 三维结构化存储器件
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Application No.: US14263322Application Date: 2014-04-28
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Publication No.: US09190416B2Publication Date: 2015-11-17
- Inventor: Ki Hong Lee , Seung Ho Pyi , II Young Kwon , Jin Ho Bin
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L29/66 ; H01L29/792 ; H01L21/223

Abstract:
In various embodiments, a three-dimensional structured nonvolatile semiconductor memory devices and methods for manufacturing the devices are disclosed. One such device includes an n-type doped region at a source/drain region; a p-type doped region at the source/drain region; and a diffusion barrier material between the n-type doped region and the p-type doped region. The n-type doped region is substantially isolated from the p-type doped region. Other embodiments are also disclosed.
Public/Granted literature
- US20140227842A1 3D STRUCTURED MEMORY DEVICES AND METHODS FOR MANUFACTURING THEREOF Public/Granted day:2014-08-14
Information query
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