Invention Grant
US09190495B2 Recessed channel array transistors, and semiconductor devices including a recessed channel array transistor
有权
嵌入式沟道阵列晶体管和包括凹陷沟道阵列晶体管的半导体器件
- Patent Title: Recessed channel array transistors, and semiconductor devices including a recessed channel array transistor
- Patent Title (中): 嵌入式沟道阵列晶体管和包括凹陷沟道阵列晶体管的半导体器件
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Application No.: US12563473Application Date: 2009-09-21
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Publication No.: US09190495B2Publication Date: 2015-11-17
- Inventor: Jeong-Do Ryu , Dong-Chan Kim , Seong-Hoon Jeong , Si-Young Choi , Yu-Gyun Shin , Tai-Su Park , Jong-Ryeol Yoo , Jong-Hoon Kang
- Applicant: Jeong-Do Ryu , Dong-Chan Kim , Seong-Hoon Jeong , Si-Young Choi , Yu-Gyun Shin , Tai-Su Park , Jong-Ryeol Yoo , Jong-Hoon Kang
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2008-0092483 20080922; KR10-2009-0041222 20090512
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/78 ; H01L29/66 ; H01L21/28 ; H01L27/105 ; H01L27/108 ; H01L27/11 ; H01L29/423 ; H01L29/51 ; H01L21/336 ; H01L21/8234

Abstract:
A recessed channel array transistor may include a substrate, a gate oxide layer, a gate electrode and source/drain regions. The substrate may have an active region and an isolation region. A recess may be formed in the active region. The gate oxide layer may be formed on the recess and the substrate. The gate oxide layer may include a first portion on an intersection between a side end of the recess and a sidewall of the active region and a second portion on a side surface of the recess. The first portion may include a thickness greater than about 70% of a thickness of the second portion. The gate electrode may be formed on the gate oxide layer. The source/drain regions may be formed in the substrate. Thus, the recessed channel array transistor may have a decreased leakage current and an increased on-current.
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Information query
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