Invention Grant
- Patent Title: Ultraviolet semiconductor light-emitting device and fabrication method
- Patent Title (中): 紫外线半导体发光元件及其制造方法
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Application No.: US14612156Application Date: 2015-02-02
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Publication No.: US09190557B2Publication Date: 2015-11-17
- Inventor: Zhibai Zhong , Jianjian Yang , Wenxin Chen , Zhaoxuan Liang
- Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Xiamen
- Assignee: Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Current Assignee: Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Xiamen
- Agency: Syncoda LLC
- Agent Feng Ma
- Priority: CN201210291658 20120816
- Main IPC: H01L33/04
- IPC: H01L33/04 ; H01L33/00 ; H01L33/32 ; H01L33/38 ; H01L27/15 ; H01L33/06 ; H01L33/10 ; H01L33/24 ; H01L33/40

Abstract:
An ultraviolet semiconductor light emitting device includes: a light-emitting epitaxial layer including an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer; a tunnel junction at a non-light-emitting surface of the light-emitting epitaxial layer and having a patterned structure with openings to expose the light-emitting epitaxial layer; an optical phase matching layer over a surface layer of the light-emitting epitaxial layer and transmissive of UV light; and a reflecting layer covering the entire tunneling junction and the optical phase matching layer. A patterned structure is provided over the tunnel junction for full-angle light reflection. Part of the tunneling junction forms ohmic contact with the low work function reflecting metal. The patterned distribution design can effectively reduce the ohmic contact resistance.
Public/Granted literature
- US20150144875A1 ULTRAVIOLET SEMICONDUCTOR LIGHT-EMITTING DEVICE AND FABRICATION METHOD Public/Granted day:2015-05-28
Information query
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