Invention Grant
- Patent Title: Thin film stack
- Patent Title (中): 薄膜堆叠
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Application No.: US14417936Application Date: 2012-07-31
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Publication No.: US09190598B2Publication Date: 2015-11-17
- Inventor: James Elmer Abbott, Jr. , Peter Mardilovich , Christopher Shelton
- Applicant: James Elmer Abbott, Jr. , Peter Mardilovich , Christopher Shelton
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Thorpe, North & Western L.L.P.
- International Application: PCT/US2012/049000 WO 20120731
- International Announcement: WO2014/021854 WO 20140206
- Main IPC: B41J2/45
- IPC: B41J2/45 ; H01L41/08 ; B41J2/14 ; H01L41/314

Abstract:
The present disclosure is drawn to a thin film stack, which includes a substrate, a metal layer, and an adhesive layer comprising a blend of from 3 at % to 94 at % indium oxide, from 3 at % to 94 at % gallium oxide, and from 3 at % to 94 at % zinc oxide. The adhesive layer is adhered between the substrate and the metal layer.
Public/Granted literature
- US20150228885A1 THIN FILM STACK Public/Granted day:2015-08-13
Information query
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